Product Description
Ceramic-filled, silicone-free thermal compound with high thermal conductivity
- Especially suitable for silicone-sensitive applications
- No drying, curing or melting of the thermal compound required
- High long-term stability
- Other container sizes and container types (e.g. cans, cartridges) available on request
Features:- Density: 1.4 g/cm3
- Temperature range: -60°C ... +150°C
- Dielectric strength: not applicable as the compound is conductive
- Thermal conductivity: 10 W/m K
- Solubility in water: insoluble