Product Description
The Zalman ZM-STC7 thermal compound offers a reliable thermal conductivity of 7.2 W/mK and is the ideal solution for heat transfer between CPU/GPU and heat sink. This high-quality thermal compound is suitable for a wide range of PC systems, including gaming PCs, workstations and systems with moderate to high performance requirements.
At 4 g, the ZM-STC7 compound is sufficient for several applications and ensures a long-lasting, stable cooling performance. Its smooth texture allows for easy and even application, effectively filling even the smallest gaps and ensuring optimal heat transfer. The paste is non-conductive, providing additional safety for sensitive hardware components.
- 7.2 W/mK thermal conductivity for stable and efficient cooling performance
- 4 g for a wide range of applications and long life
- Easy to use thanks to smooth consistency for precise application
- Non-conductive, meaning it is safe for use on sensitive hardware
