Fine solder Made in Taiwan, significantly improved electrical conductivity by a composition with a silver content of 3.5%.
NO-CLEAN solution with continuous flux cores.
No cleaning of solder joints required soldering
Agile and halogen-free, low smoke generation.
Composition:
• 3.5% silver
• 0.7% copper
• 95.8% tin
• Flux content: 2%
• Melting point: 217°C