Fine solder Made in Taiwan, significantly improved electrical conductivity by a composition with a silver content of 3.5%.
NO-CLEAN solution with continuous flux cores.
No cleaning of solder joints required solderingAgile and halogen-free, low smoke generation.
Composition:• 3.5% silver• 0.7% copper• 95.8% tin• Flux content: 2%• Melting point: 217°C