Description
For applications where thermal paste is not an option due to unmanageable application or where distances between heat source and cooling element need to be bridged, the Thermal Grizzly minus pad 8 is the ideal choice – for example on memory chips and voltage transformers. It is based on a silicon-containing supporting complex and aluminium oxide as a heat transfer medium – as well as thermal pastes and thus it is also similar in terms of performance.
The minus pad 8 is available in three different dimensions – here 120 x 20 mm – as well as in four thicknesses between 0.5 and 2 millimetres, with the pads available already functioning excellently at a very low contact pressure and the thermal conductivity only marginally influenced by the thickness. The choice of the thickness should therefore only depend on the gap to be bridged.
Technical details:
- Dimensions 120 × 20 × 1.5 mm
- Number: 1
- Thermal conductivity: 8 W/(m·K)
- Application temperature: -100 to +200°C
