The solution for your future soldering needs: lead-free
SSAC 2010 lead-free solder wire with three metals and silver content for Fine Pitch components
Flux-powder as per F-SW 32
-> Barely visible, clear flux-powder residue
Not necessary to clean the PCB boards -> NO - CLEAN
Eutectic solder, i.e. the solder is either in a solid or liquid state, there is no paste-like transition state
-> No bonded solder joints
-> Particularly important for the smallest solder joints with minimum solder volume
Ideal for use in SMD technology, in particular Fine Pitch components and micro components
Sn 96.5 Ag Cu0.5
Silver-containing alloy makes soldering of SMDs and precision connections easier
Little smoke is produced
Lower soldering repair temperature compared to conventional lead-free soldering
-> Easier to use for users
Melting point:
• Solid: 217°C
• Liquid: 217°C
