Product Description
The solution for your future soldering needs: lead-freeSSAC 2010 lead-free solder wire with three metals and silver content for Fine Pitch componentsFlux-powder as per F-SW 32-> Barely visible, clear flux-powder residueNot necessary to clean the PCB boards -> NO - CLEANEutectic solder, i.
e.
the solder is either in a solid or liquid state, there is no paste-like transition state-> No bonded solder joints-> Particularly important for the smallest solder joints with minimum solder volumeIdeal for use in SMD technology, in particular Fine Pitch components and micro componentsSn 96.5 Ag Cu0.
5Silver-containing alloy makes soldering of SMDs and precision connections easierLittle smoke is producedLower soldering repair temperature compared to conventional lead-free soldering-> Easier to use for usersMelting point:• Solid: 217°C• Liquid: 217°C
