Product Description
The phase-change material on which the PhaseSheet PTM is based is solid at room temperature. The material only begins to liquefy at temperatures above 45°C. A high contact pressure of around 300 - 400 N is required for optimum distribution of the liquid PhaseSheet PTM and thus the lowest possible layer thickness. PhaseSheet PTM has a very low viscosity in its liquid state and contracts again when it changes to a solid material, thus minimising the pump-out effect.
The pump-out effect is particularly pronounced when combining a copper cooler on a graphics chip because silicon and copper have different linear expansion when heated. The temperatures under load cause the heatspreader and the base plate to deform (concave or convex) and return to their original shape (straight) when they cool down. As a result, the thermal paste is slowly pressed out between the heatspreader and the base plate of the CPU cooler, for example.
