Product Description
"Thermal compound with siliconeTemperature range: -40°C .
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+250°CThermal conductivity: 0.61 W/m KDensity (DIN 51757): 1.1 g/cm3Operating temperature range: -40 to +250°CShelf life: 12 monthsApplication: As a contact paste when installing electronic components to ensure the highest possible heat transfer of semiconductors to the cooling surfaces.
Features:Two-phase mixing system based on polydimethylsiloxane with a low viscosity-temperature curveIntegrated filler ensures optimum heat dissipationExtreme temperature and oxidation resistanceLow consistency change over a wide temperature rangeHydrophobicExcellent dielectric properties"
