Description
Thermal compound with silicone
- Temperature range: -40°C ... +250°C
- Thermal conductivity: 0.61 W/m K
- Density (DIN 51757): 1.1 g/cm3
- Operating temperature range: -40 to +250°C
- Shelf life: 12 months
Application: As a contact paste when installing electronic components to ensure the highest possible heat transfer of semiconductors to the cooling surfaces.
Features:- Two-phase mixing system based on polydimethylsiloxane with a low viscosity-temperature curve
- Integrated filler ensures optimum heat dissipation
- Extreme temperature and oxidation resistance
- Low consistency change over a wide temperature range
- Hydrophobic
- Excellent dielectric properties
