Plated-through and glossy tin-plated epoxy dot matrix board with two-sided Cu coating.
Card for very high-quality and highly integrated modules. Double-sided conductor path routing possible.
Dimensions: 100 x 160 mm
Grid: 2.54 mm
Rows of holes: 37
Holes: 1.0 mm
Cu coating: 2 x 35 µ tin-plated and plated-through
Material thickness: 1.5 mm
