This aluminium oxide-based thermal paste offers reliable thermal performance with a thermal conductivity of 8 W/mK. No drying time is required prior to application.
The optimum consistency makes the paste easy to apply. It evenly closes gaps between the CPU core and the heat sink, keeping temperatures low - perfect for overclocking projects.
The range of application is between -150°C and 350°C, providing a generous temperature buffer. The paste is electrically non-conductive and therefore safe to use.
Included in delivery: