Product Description
Lead-free ''NO-CLEAN'' - SMD - solder paste
CR 11 solder paste is a sophisticated, high-tech product that is ideally suited for all types of lead-free SMD applications. Its processing temperature of approximately 215 - 260°C means that even the most sensitive components can be soldered. The pure melting temperature in the solder joint is 138°C. This is a very low temperature range, which allows repairs on sensitive components in particular.
The flux composition corresponds to F-SW 32 (DIN EN 29454.1.2.3) with a synthetic base. The flux is completely halogen free.
The solder alloy has the following composition: Sn42Bi58.
Caution: Must not be mixed with leaded material!
The unopened container should be stored at 20°C room temperature. Once opened, the maximum processing time depends on environmental influences.
Instructions for use: After removing the paste, the nozzle must be sealed again as tightly as possible. Used and fresh paste should not be stored together in the same container. Of course, they can be used together during ongoing work. However, different solder alloys and paste types must not be mixed.
Benefits:
- NO-CLEAN paste
- Low processing temperature
- Excellent contour stability
- Minimal solder ball or spatter formation
- Long-term processing and long-term storage possible
- Ideal for ''fine-pitch'' applications
- Excellent soldering results when used with hot air and soldering irons
- Different sizes of conical dispensing needles (optional)
