Product Description
"The Zalman ZM-STC7 thermal compound offers a reliable thermal conductivity of 7.2 W/mK and is the ideal solution for heat transfer between CPU/GPU and heat sink.
This high-quality thermal compound is suitable for a wide range of PC systems, including gaming PCs, workstations and systems with moderate to high performance requirements.
At 4 g, the ZM-STC7 compound is sufficient for several applications and ensures a long-lasting, stable cooling performance.
Its smooth texture allows for easy and even application, effectively filling even the smallest gaps and ensuring optimal heat transfer.
The paste is non-conductive, providing additional safety for sensitive hardware components.
7.2 W/mK thermal conductivity for stable and efficient cooling performance4 g for a wide range of applications and long lifeEasy to use thanks to smooth consistency for precise applicationNon-conductive, meaning it is safe for use on sensitive hardware"
