This module provides a bi-directional half-duplex interface used in automotive and industrial LIN systems in line with the LIN BUS specifications version 2.1 and SAE J2602.
The module is protected against short circuit and over-temperature by internal circuits.
Under compliance with all stringent regulations, this module was developed for the automotive sector to work perfectly in its environment.
• max.
Baud rate (KBaud): 20MCP200 X range products:• 8-pin SOIC, DFN and SOIC housing• MCP2003, LIN-compatible driver with wake-pins• MCP2004, LIN-compatible