Description
5 Pack Resealable nozzles Thermal conductivity: 1.93 W/m-K at 25°C or higher
- THERMAL PASTE 5 PACK: Metal-oxide-based compound may help to improve the heat dissipation of CPUs and other computer chips, provides better thermal conductivity than standard thermal compounds with negligible electrical conductivity
- HIGH THERMAL CONDUCTIVITY: Suitable for use at temperatures from -30°C to 180°C, this compound has a thermal conductivity of 3.07 W/m-K at 25°C or higher, ideal for maintenance of workstations or desktop CPUs/GPUs
- PRACTICAL SIZE: Each tube contains 1.5 g of paste (4-6 applications), with a resealable nozzle that prevents it from drying out. The 5 pack is ideal for application to multiple workstations and provides enough compound for 20-30 applications
- CERTIFIED: This thermal compound is CE and RoHS certified, so you can be sure it is safe for its intended use. The mixture contains 50% silicone, 30% carbon and 20% metal oxide.
